NcodiN
Created in 2023
Trend leader (A+)
Existing signals make this entity one of the most dynamic startupsSocial networks
1,691Activities
Technologies
Entity types
Location
10 Bd Thomas Gobert, 91120 Palaiseau, France
Palaiseau
France
Employees
Scale: 11-50
Estimated: 19
Engaged catalyst
16
0 0Added in Motherbase
10 months, 4 weeks ago
Value proposition
Nano-Lasers. Limitless Scaling.
At NcodiN, we are redefining how chips communicate. We unlock a new era of ultra-fast, energy-efficient optical interconnects, powered by a breakthrough technology: the world’s smallest laser integrated on silicon. This means AI hardware that is smaller, faster and dramatically more efficient, enabling limitless scalability while consuming less power.
In a world that demands speed, optical interconnects are the express lanes of the future, built for AI’s full potential. The shift is inevitable, and at NcodiN we are making it happen.
Integrated nanolasers, Nanophotonics, Silicon Photonics, and Photonic Integrated CircuitsOriginal language
Nano-Lasers. Limitless Scaling.
At NcodiN, we are redefining how chips communicate. We unlock a new era of ultra-fast, energy-efficient optical interconnects, powered by a breakthrough technology: the world’s smallest laser integrated on silicon. This means AI hardware that is smaller, faster and dramatically more efficient, enabling limitless scalability while consuming less power.
In a world that demands speed, optical interconnects are the express lanes of the future, built for AI’s full potential. The shift is inevitable, and at NcodiN we are making it happen.
Ncodin - Our vision: an optical interposer - Illuminating the future of computing
The High Performance Computing (HPC) and ArtificiaI Intelligence (AI) era requires unprecedented computing capabilities. With this in view, industry is heading towards zettascale supercomputers, based on >100k processing units. Chiplets-based disaggregated processors and memory-centric computing architectures are taking over and require an ever more intensive communication between dies. Thus, today interconnect bottleneck is the main
https://ncodin.com/
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